16 May 2022

High-resolution Laser Ultrasound scanning enables internal material flaw imaging for semiconductor applications

A laser scans over the material surface and generates an ultrasonic sound wave. Underneath the blue metal plate sits the Optical Microphone which listens to the ultrasonic wave being transmitted through the sample. Software then allocates each spatial coordinate with any local sound event and plots an acoustic ultrasonic transmission image. The XARION logo (a few µm deep only) marks the location of an internal material flaw, e.g. inside a semiconductor component. Ultrasonic imaging without water or gel!