Microelectronics Inspection
Detect Cracks and Delaminations Inside Microelectronic Components
XARION's unique laser-based technology enables the ultrasonic NDT inspection of microelectronic components without any contact, water or coupling liquid. XARION's microelectronic test equipment is available as a stand-alone desktop tool for microelectronic testing in fail labs and R&D laboratories and can also be integrated into a high-volume production line to enable 100% quality control.
The desktop station offers two operation modes: a high-speed, non-contact imaging mode, and the ultrafast single-shot quality control mode. Both modes enable electronic chip testing by offering non-contact, non-destructive detection of delamination and other internal defects. In the imaging mode, these defects can be located and analyzed in detail, while the single-shot mode offers unparalleled speed with up to 1000 components inspected per second. Utilizing XARION's technology increases your productivity in failure analysis and greatly improves reliability in production!
Features
- Compact and highly versatile desktop tool or fully automated inline inspection system
- 100% documented safety for your customer with the inline inspection system
- Unique non-contact sensor technology without contact, water or coupling liquids
- No interference with other production steps
- High-speed imaging mode with up to 10,000 imaging points per second
- Single-shot inspection mode for up to 1,000 samples per second
- Combination with offline non-contact imaging of defective components for further analysis possible
